※ We perform detailed glass cutting using high-precision dicing equipments.
※ We produce and process very reliable parts by preventing particle and progressive crack through
    embodying 4 chambers for each surface.
※ We provide process control of particle under 20um using the semiconductor cleaning process

 

 

※ Assembled in 10 Class room to maintain very clean surface.
※ Provides IR Filter Ass'y of CSP, COB, COF types.